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Reflow solder in the electronic industry has now become the indispensable process, especially lead-free reflow soldering, in terms of modern environmental protection welding, plays a more important effect, the following interpretation of several common question reflow soldering process, the hope can give you some reference, and please fellow teachers to make up and correct.

　 Flux coking is particularly common in reflow soldering technology problem, usually causes are overtemperature caused.

Processing method can use to add tape speed, may reduce the default zone temperature. Presents the tin bridge reason has 3: position is not appropriate or sheet opposite tin. Solder paste cave; Heated too fast. Processing method: check the positioning or clean sheet, adjust the printing pressure; Add metal composition, viscosity; Adjusted to the appropriate temperature time curve. Tin move or fall because of reflow soldering timeout or damp environment temperature is too high, which is formed by the, of course, also may be the reason for the tin slurry viscous force is small. Processing methods are: regulate curve or add tape speed may control environment humidity; Choose the suitable solder paste. Element erect image contrast common in lead-free reflow soldering, mostly because of uneven heating too fast or to form, if the components of poor weldability, solder paste composition is not stable and easy to appear this kind of defect. The processing method is: adjust the temperature time curve, take a closer look at

FAQ

A few common problem solving methods of reflow soldering